Chad Hammerlind



Education and Clerkships

J.D., William Mitchell College of Law, 2011, cum laude; Executive Editor 2010-2011, Staff Member 2009-2010, Cybaris (William Mitchell’s IP Law Journal)

B.Bm.E., University of Minnesota, 2006




U.S. Patent and Trademark Office


Chad Hammerlind is an associate in the Intellectual Property Practice Group in the Austin office of Haynes and Boone. His practice focuses on drafting and prosecuting domestic patent applications related to electrical, telecommunication, mechanical, medical device, software, and computer technologies.

Prior to becoming a lawyer, Chad was a radiation oncology field engineer and led installations and commissioning of multimillion-dollar radiation oncology treatment systems including imaging systems, patient positioning systems, radiation collimators, and cancer treatment planning software.

Professional and Community Activities

  • Pro bono work for Georgia Lawyers for the Arts by assisting inventors in patenting their inventions
  • Volunteer coach for youth soccer and baseball at Town and Country Optimist Club
  • Volunteer coach for youth basketball and baseball for i9 Sports
  • Participant in the Clemency Project and assisted in the early release of prisoners who were serving long sentences for non-violent drug related crimes
  • Participant in Georgia Lawyers for the Arts by assisting indigent inventors with prosecuting patent applications before the USPTO


IP Beacon

The IP Beacon

The IP Beacon is a Haynes and Boone Newsletter highlighting current issues and trends in Intellectual Property Law. Read the latest issue...


Chad has experience in technologies including those relating to:

  • Computer software, including streaming applications, artificial intelligence/cognitive computing with Watson, data mining/analytic algorithms, application binary interfaces, data deduplication, and data encryption.
  • Electrical and computing devices, including error detection and corrections circuits, memory systems with SRAM and DRAM, processors, virtual machines, cloud computing, and LBIST circuits.
  • Mechanical devices, including EMI shielding, server racks and doors, electrical connectors, and heat boxes.
  • Medical devices, including heart pacing devices, heart valves, male and female urological devices, implantation devices, ultrasound, and medical imaging technologies.
  • Semiconductor devices, including eFuses, finFETs, transistors, and 3D semiconductor chip structures and connectors.
  • Telecommunications, including personalized content delivery systems, DVR, communications standards, Internet of Things, entitlement systems, and networks.

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